Manz offers cleaning, developing, etching, and stripping processes in wet chemistry, primarily applied in the production of high-end semiconductor panel-level packaging (PLP), IC substrate, and display.
With nearly 40 years of experience in handling a variety of substrates in the photoresist process, our expertise ensures a high particle removal ratio, superior resolution, and thorough removal of remaining photoresist. This enables process flexibility across multiple applications.
|
Semiconductor |
IC Substrate Core |
IC Substrate TGV |
Display | |
|---|---|---|---|---|
| Material | EMC | FR-4 | Glass | Glass |
| L/S | 2/2 | 40/40 um | 2/2 um | 2/2 um |
| Substrate size | max. 700 x 700 mm | 510 x 515 mm | 510 x 515 mm | max. 2940 x 3370 mm (G10.5) |
