Since 1986 we are the reliable partner for manufacturers from the semiconductor industry. With our innovative key technology, we are taking high-density packaging for semiconductors to a new level.
We are innovation leaders in the field of packaging technologies. The development towards high portability and multifunctionality of electronics, including AIoT, 5G and smart vehicles, requires compact, more powerful, and cost-effective ICs. This has led to a boom in advanced packaging technologies, such as RDL process and Fan-out panel level packaging (FOPLP).
The rising demand of modern electronics is boosting the technology of homogeneous or heterogeneous integration. Leveraging the RDL process, the latest multi-chip packaging trends are shifting from PCB or IC substrate to advanced integration technologies such as thin film process or 2.5D silicon interposer.
At Manz, we employ the best practices to optimize Fan-Out Panel Level Packaging (FOPLP) production efficiency. We offer comprehensive services ranging from equipment provision to production fab planning, ensuring a seamless and efficient manufacturing process. Our high-precision product equipment manufacturing and fully automatic production systems are designed to deliver superior performance and reliability.
With our extensive expertise and proven services across diverse industries, we excel in various FOPLP processes tailored to customer requirements. From single tool validation to pilot-line verification and new fab simulation, our fabrication planning, and implementation services enhance production efficiency, resulting in higher throughput and reduced production costs. Manz's solutions are suitable for a variety of substrates, including FR4, PI, stainless steel, and glass, providing flexibility for different production needs.
Contact us to learn more about our FOPLP expertise and see the difference we can make for your business.
